Labels Milestones
BackWide, 5.3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket.
- -0.871977 0.0992491 vertex -3.40623 -7.23862.
- -8.184141e-01 -1.851914e-03 -5.746260e-01 vertex -1.075850e+02.
- Normal -3.508240e-001 -6.139420e-001 7.071052e-001 facet.