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Wireless RAK811 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK811/Hardware_Specification/RAK811_LoRa_Module_Datasheet_V1.4.pdf RAK4200 LPWAN Module https://downloads.rakwireless.com/LoRa/RAK4200/Hardware-Specification/RAK4200_Module_Specifications_V1.4.pdf Class 2 Bluetooth Module with on-board Fireball/Fireball.kicad_pcb | 7889 Fireball/Fireball.kicad_sch | 3951 Fireball/fp-info-cache | 36 Schematics/Fireball.kicad_sch | 4790 Schematics/Fireball_VCO.pdf | Bin 292501 -> 0 bytes From 2bb058d5715f395d3571ea05d3008566787a2bdb Mon Sep 17 00:00:00 2001 Subject: [PATCH] glide fix - Single-step button (SW13) isn't producing a high enough voltage to trigger steps. Replace C10 with 100K resistor, and bridge out R44 with a 7-segment display with LED backlight 240x128 http://www.lcd-module.com/fileadmin/eng/pdf/grafik/edip240-7e.pdf LCD graphical display 480x272 16-bit colour with led backlight http://www.lcd-module.com/fileadmin/eng/pdf/grafik/ediptft32-ae.pdf TFT-graphic display 320x240 16 bit colour with LED backlight 128x64 RS-232 I2C or SPI 3 Line 12 character wide alpha numeric LCD LCD-graphical display with LED backlight 240x128 LCD display 320x340 RS-232 I2C or SPI 3 Line 12 character wide alpha numeric LCD LCD-graphical display with LED backlight 160x104 RS-232 I2C or SPI http://www.lcd-module.com/fileadmin/eng/pdf/grafik/edip160-7e.pdf LCD-graphical display with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100CY, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for diode bridges, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 5.25.

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