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46007-1105, With thermal vias 10-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST XA series connector, B16B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST SH series connector, S28B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated.

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