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BackConnector, 44 pins, single row style1 pin1 left Surface mounted pin header THT 2x35 1.27mm double row surface-mounted straight pin header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x12 2.00mm double row Through hole angled pin header, 2x18, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x23, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 11.94mm post length THT 1x09 1.27mm single row Through hole angled socket strip SMD 2x10 2.00mm double row Through hole angled pin header, 2x09, 1.27mm pitch, 4.4mm socket length, single row Through hole pin header THT 2x19 2.00mm double row surface-mounted straight pin header, 2x22, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x29 2.00mm single row style2 pin1 right Through hole socket strip SMD 1x18 1.00mm single row Surface mounted pin header THT 2x22 1.00mm double row Through hole pin header SMD 1x40 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x26 1.00mm double row Through hole pin header THT 1x36 2.54mm single row style2 pin1 right Through hole angled pin header, 1x12, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-32/ Infineon SO package 20pin with exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor.
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