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4x4, 0.5P; CASE 505AB (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [QFN] with thermal vias 10-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator JST PUD series connector, S2B-EH.

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