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- 14x14x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad 3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x16 2.54mm double row Through hole angled socket strip SMD 2x11 1.00mm double row surface-mounted straight pin header, 2x09, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x23 1.27mm double row Through hole straight pin header, 1x36, 2.00mm pitch, single row Surface mounted pin header THT 2x19 1.27mm double row SMD IDC box header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip THT 2x29 1.00mm double row Through hole angled socket strip THT 2x25 1.27mm double row Through hole angled pin header THT 2x07 2.54mm double row Through hole pin header SMD 2x16 2.00mm double row surface-mounted straight pin header, 2x09, 1.00mm pitch, single row Surface mounted pin header THT 2x12 2.54mm double row surface-mounted straight pin header, 1x12, 2.00mm pitch, double rows Through hole straight socket strip, 1x14, 1.00mm pitch, single row Surface mounted pin header THT 1x26 1.27mm single.

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