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Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm.

• See https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27.
• 0.422682 0.361949 0.830862 vertex.
• Pitch 20.07mm diameter 27.9mm Vishay IHB-3.

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