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Package (JQ) - 4x4x0.5 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 4 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf.

• Normal -0.338904 0.0729974 0.937985 facet normal -0.417289 -0.223046.
• Microphone LGA Dust Water TDK InvenSense.
• 30x12.5mm^2 drill 1.4mm pad 2.6mm.
• 6.764269e+000 9.983999e+000 vertex -4.608007e+000 5.307639e+000 9.983999e+000 vertex.
• -2.932777e-003 7.524720e-001 facet normal -8.416038e-01 -3.471391e-03 -5.400843e-01.

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