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BackIrd*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: unplated through holes: unplated through holes: ============================================================= 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Add schematic, start on PCB with on-board components PCB initial layout, no traces "solder_mask_clearance": 0.0, PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "other_line_width": 0.15, PCB initial layout, no traces }, More tweaks after pro review "multiple_net_names": "warning", "net_not_bus_member": "warning", "no_connect_connected": "warning", "no_connect_dangling": "warning", "pin_not_connected": "error", "pin_not_driven": "error", "pin_to_pin": "warning", "power_pin_not_driven": "error", "similar_labels": "warning", More tweaks after pro review "clearance": 0.2, "diff_pair_gap": 0.25, "diff_pair_via_gap": 0.25, "diff_pair_width": 0.2, "line_style": 0, "microvia_diameter": 0.3, "microvia_drill": 0.1, "name": "Default", "pcb_color": "rgba(0, 0, 0, 0.000)", "schematic_color": "rgba(0, 0, 0, 0.000)", "schematic_color": "rgba(0, 0, 0, 0.000)", "track_width": 0.25, "via_diameter": 0.8, "via_drill.
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