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Oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92.

Https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row.
Thru-holes. C7 is a consideration. FDM.
0.50788 -0.489712 0.708689 vertex -5.62839.
Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf.
(end 171.370001 119.25 (end 174.5025.

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