Labels Milestones
Back(PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 2x10 2.00mm double row surface-mounted straight pin header, 2x28, 2.54mm pitch, double rows Through hole angled pin header, 1x26, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x33 1.00mm single row Through hole angled socket strip, 2x03, 2.00mm pitch, single row Through hole pin header THT 1x01 2.54mm single row Surface mounted pin header SMD 2x31 1.27mm double row Through hole angled pin header, 2x21, 1.27mm pitch, double rows Surface mounted socket strip THT 1x26 2.00mm single row Surface mounted socket strip SMD 2x12 1.00mm double.
- 90814-0024, 24 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated.
- 4.0mmx4.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-3030.