Labels Milestones
Back5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 6 pin, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x25, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x06 1.00mm single row style2 pin1 right Through hole straight pin header, 1x05, 2.00mm pitch, single row Surface mounted pin header SMD 2x03 2.54mm double row Through hole angled pin header THT 2x09 2.00mm double row Through hole straight socket strip, 1x16, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip SMD 2x37 2.00mm double row Through hole angled pin header SMD 1x04 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x39 2.54mm double row Through hole angled pin header SMD 2x09 2.54mm double row Through hole socket strip THT 2x38 1.27mm double row surface-mounted straight socket strip, 1x01, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x05, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x20 1.00mm single row Surface mounted pin header THT 2x19.