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A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 1x24 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x19 1.00mm single row Through hole pin header THT 2x34 1.27mm double row Through hole straight pin header, 2x09, 1.27mm pitch, 4.0mm pin length, single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted socket strip SMD 1x27 2.00mm single row Through hole straight socket strip, 2x28, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x28 1.27mm single row Surface mounted socket strip SMD 1x16 1.00mm single row Surface mounted pin header THT 2x11 2.54mm double row Through hole IDC header, 2x15, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted pin header THT 1x31 2.00mm single row Through hole angled socket strip, 1x01, 2.54mm pitch, 6mm pin length, single row Through hole straight pin header, 2x03, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 1x35 2.54mm single row Through hole.

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