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DE/UE Package; 12-Lead Plastic Micro Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors.

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