3
1
Back

Http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x37 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x33 1.27mm single row Through hole straight pin header, 1x09, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x36 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x04 1.00mm single row style1 pin1 left Surface mounted pin header SMD 2x30 1.27mm double row Through hole angled socket strip, 2x36, 2.00mm pitch, 4.2mm pin.

New Pull Request