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(MF) - 3x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [TQFP] thermal pad LQFP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD), generated with kicad-footprint-generator JST XH series.

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