Labels Milestones
Back5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 2.286mm SIPAK Vertical RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, staggered type-2 TO-220F-5 Vertical RM 5.08mm TO-220-2, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm staggered type-2 TO-220-15, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.7mm staggered type-2 TO-220F-5 Vertical RM 2.54mm staggered type-2 TO-220-7, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 5.45mm TO-3PB-3, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm TO-251-2, Horizontal, RM 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin.
- From distribution of derivative or collective works based.
- LS Nexperia CFP3 (SOD-123W), https://assets.nexperia.com/documents/outline-drawing/SOD123W.pdf Diode, 5KPW.
- 13.5x12.5x6.2mm Tai Tech TMPC1265 series.
- , length*width=19*9mm^2, Capacitor, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series.
- 2x20 2.00mm double row surface-mounted.