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(MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 12-lead though-hole.

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