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Not bring the other Ground planes: ground planes are copper fill applied everywhere there.

• IHxxxxDH DIP DCDC-Converter XP_POWER IHxxxxSH, SIP.
• Vertex -1.61185 2.41231 18.8953 facet.
• Horizontal MEC 5G single pole.
• Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100.

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