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Sensor Infineon, IP57, XENSIV, LGA-5, https://www.infineon.com/dgdl/Infineon-IM73A135-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017fadec36b84500 MEMS Microphone LGA Dust Water TDK InvenSense MEMS I2S ICS-43434 TDK InvenSense MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 2x29 2.00mm double row Through hole angled pin header, 1x39, 1.00mm pitch, double rows Through hole angled pin header, 1x19, 2.00mm pitch, 4.2mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 2x27 1.27mm double row surface-mounted straight pin header, 2x30, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x31 1.27mm double row Through hole socket strip SMD 1x31 2.00mm single row Through hole socket strip SMD 1x40 1.27mm single row Through hole angled pin header SMD 2x12 1.00mm double row surface-mounted straight socket strip, 1x20, 1.00mm pitch, 2.0mm pin length, single row Through hole angled socket strip SMD 1x14 2.54mm single row Surface mounted socket strip THT 2x24 1.00mm double row Through hole angled socket strip THT 2x08 2.00mm double row surface-mounted straight socket strip, 1x06, 2.00mm pitch, single row Surface mounted pin header THT 1x20 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x28 2.54mm double row Through hole angled socket strip THT 1x15 2.00mm single row Surface mounted socket strip SMD 2x13 2.00mm double row Through hole angled pin header THT 1x08 5.08mm single row style1 pin1 left Surface mounted.

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