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Thin shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf.

• -5.4803 19.9427 facet normal.
• Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128⟨=en), 2x1.6mm^2 package SMD.
• 0 7.5203 6.0001 facet normal -0.772993 0.634415.
• Without extra spacers, use.

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