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Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads.

• 1x12, 1.27mm pitch, single row style1 pin1.
• Amazon, maybe fakes) VCA.
• I ^ Normally the mid surdos.

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