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SMD 1x33 1.27mm single row Through hole straight socket strip, 2x24, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled socket strip THT 2x17 2.54mm double row surface-mounted straight pin header, 2x32, 2.54mm pitch, 8.51mm socket length, double rows Surface mounted socket strip THT 1x13 5.08mm single row Through hole angled pin header SMD 1x34 2.54mm single row Surface mounted pin header THT 2x15 1.27mm double row surface-mounted straight socket strip, 2x39, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x06 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x26, 1.00mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled socket strip THT 1x35 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x24, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x24 1.27mm single row Through hole angled pin header, 1x35, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x31 2.00mm single row Surface mounted pin header THT 1x05 1.00mm single row Through hole angled pin header SMD 1x30 1.00mm single row male, vertical entry Harwin LTek Connector, 20 pins, dual row male, vertical entry Harwin LTek Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flatpack (MW) - 10x10x1.0 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body (see Atmel Appnote 8826 10-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/PCF8523.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xx-DV-TE, 50 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-BE-A, 22 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0430, 4.

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Updates 13c8bcac477b612d33e1b1cfe89a6f9adc0a8935 Adding SynthMages footprint library.
(maybe the same form factor, with maybe.

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