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B06B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator JST PH series connector, SM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-A, 11 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.espressif.com/sites/default/files/documentation/esp32_datasheet_en.pdf#page=38), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 7, Wuerth electronics 97730406332 (https://katalog.we-online.com/em/datasheet/97730406332.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 2mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 horizontal, leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 24 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin straight chassis connector Dual front isolated BNC plug (https://www.amphenolrf.com/downloads/dl/file/id/2980/product/644/031_6575_customer_drawing.pdf Dual BNC Horizontal Isolated Subminiature Coaxial Switch 1.35mm High, DC to DC Converters dc-dc recom buck sip-12 pitch 2.54mm size 30.94x6.5mm^2 drill 1.1mm pad 2.1mm Terminal Block Phoenix PTSM-0,5-6-2.5-H-THR pitch 2.5mm size 9.7x10mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-416, 45Degree (cable under 45degree), 2 pins, pitch 5.08mm, revamped version of bornier6 Terminal Block Phoenix MKDS-3-9-5.08, 9 pins, pitch 7.5mm, size 119x15mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal.

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