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900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

• GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE.
• -0.678285 0.705402 facet normal -0.0983915 -0.0148308 -0.995037.

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