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Plug (https://www.amphenolrf.com/downloads/dl/file/id/2980/product/644/031_6575_customer_drawing.pdf Dual BNC Amphenol Horizontal Panel-mountable BNC connector mounted through PCB, vertical BNC RF Interface, PCB mount 4 pin straight chassis connector Dual front isolated BNC plug (https://www.winconn.com/wp-content/uploads/364A2595.pdf Dual BNC Amphenol Horizontal Panel-mountable BNC connector mounted through PCB, vertical BNC RF interface bayonet 50ohm BNC female PCB mount (https://www.amphenolltw.com/2012download/2D%20PDF/03_M%20Series%20Sensor%20Connectors/M8S-XXPMMR-SF8001.pdf 3.5 mm, Stereo, Right Angle, Surface Mount, ZIF, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022503391_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator connector JST VH series connector, 502585-1370 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator JST VH PBT series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator crystal Epson Toyocom FA-238 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package SMD Crystal MicroCrystal CC7V-T1A/CM7V-T1A series http://www.microcrystal.com/images/_Product-Documentation/01_TF_ceramic_Packages/01_Datasheet/CC1V-T1A.pdf, hand-soldering, 3.2x1.5mm^2 package SMD Crystal Seiko Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 9.6x4.1mm^2 package SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal G8, 3.2x1.5mm^2 package SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems SIP-4, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead.

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