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Transducer (https://www.lem.com/sites/default/files/products_datasheets/ho-np-0000_series.pdf LEM HO 8/15/25-NP Current Transducer (https://www.lem.com/sites/default/files/products_datasheets/ho-nsm-0000_series.pdf LEM HO 8/15/25-NSM Current Transducer (https://www.lem.com/sites/default/files/products_datasheets/la_25-p.pdf LEM current transducer LEM_LTSR-NP 5V supply voltage series https://www.lem.com/sites/default/files/products_datasheets/ltsr_6-np.pdf DFN, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.25 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xx-DV-PE-LC, 40 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator JST SH series connector, S14B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 5, Wuerth electronics 9775051960 (https://katalog.we-online.com/em/datasheet/9775051960.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas SIL0010A MicroSiP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator JST XA series connector, 504050-0791 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-11A example for new mpn: 39-30-0220, 11 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 6, Wuerth electronics 9771120360 (https://katalog.we-online.com/em/datasheet/9771120360.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-10A example for new part number: A-41792-0008 example for new mpn: 39-30-0040, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas WSON-6 DQK, http://www.ti.com/lit/ds/symlink/csd16301q2.pdf Texas DRC0010J, VSON10 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.65mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster.

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