synth_tools

Back

22.86mm 900mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 11x-dip-switch SPST CTS_Series194-11MSTN, Piano, row spacing 10.16 mm (400 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SM) - 5.28 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 32.2x9.1x15mm^3, https://www.recom-power.com/pdf/Innoline/R-5xxxPA_DA.pdf dc-dc recom buck sip-3 pitch 2.54mm size 20.78x6.5mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00029, 8 pins, pitch 10mm, size 45x10.3mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xx-DV-TE, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 5, Wuerth electronics 9774060482 (https://katalog.we-online.de/em/datasheet/9774060482.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (https://ams.com/documents/20143/36005/AS7341_DS000504_3-00.pdf/#page=63 LGA, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-J (1608-08 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1230, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3591, 35 Circuits (http://www.molex.com/pdm_docs/sd/5022503591_sd.pdf), generated with kicad-footprint-generator JST XH series connector, BM12B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, 4 Pins.

New Pull Request

Labels Milestones