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BackOrd*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: merged pull request 'More schematics' (#3) from schematic into main 1705ad98fb Put title box in PDF export' (#4) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 Component Count: 77 Refs 3 pin Molex connector 2.54 mm spacing D 3 pin Molex header 2.54 mm spacing | | Tayda | A-2939 | | Tayda | A-559 | | | | J11 | 1 uF | Polarized capacitor | | | | | J9 | 1 | SW_3PDT_x3 | Switch, dual pole double throw, separate symbols | | | | Tayda .
- 7 2,5mm vertical SMD.
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- Pin pitch=15.00mm, , length*width=16.5*4.9mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf.