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Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x18 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x21 2.00mm single row Surface mounted socket strip SMD 1x16 2.54mm single row Through hole angled pin header, 1x30, 1.27mm pitch, 4.4mm socket length, single row Through hole.

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