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Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch.

• Grants from a particular Contributor. A Contribution “originates”.
• 7mm diameter 3.3mm Fastron MICC.
• Sockets, ceramic capacitors, power header, transistors, film caps.

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