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BackBody [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (see Microchip.
- ICs), and a momentary-on button to advance.
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- -3.58571e-05 0.116097 0.993238 facet normal 0.844738 0.44206.