3
1
Back

DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flat, No Lead Package - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package.

New Pull Request