Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x22 2.54mm double row Through hole pin header THT 1x06 2.54mm single row Surface mounted socket strip THT 1x01 2.54mm single row Through hole angled pin header THT 1x09 1.00mm single row style2 pin1 right Through hole socket strip SMD 1x32 1.27mm single row Through hole pin header THT 1x03 2.00mm single row style2 pin1 right Through hole straight pin header, 1x16, 1.00mm pitch, double rows Through hole pin header SMD 2x18 1.00mm double row Through hole socket strip THT 1x27 1.27mm single row Surface mounted pin header SMD 1x35 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x24, 2.54mm pitch, 6mm pin length, double.
- 0.688669 -0.165323 0.705976 facet normal 0.000000e+00 -1.000000e+00 -0.000000e+00.
- DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3.