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SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP.

• Strip, HLE-103-02-xxx-DV-BE, 3 Pins.
• 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder.
• Connector, B16B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Hirose series.
• 9.0mm, 2 pins LED_Rectangular, Rectangular.
• Battery CR-2032 coin cell vertical.

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