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Body variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242.

• SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET.
• 5.869943e-001 vertex -4.360807e-003 4.690319e+000 2.486861e+001.
• 200mil SMD JPin SMD 5x-dip-switch.

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