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( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C receptacle for USB 2.0 Type C Receptacle, https://gct.co/Files/Drawings/USB4085.pdf USB Type-C Receptacle SMD GT-USB-7051A GT-USB-7051B USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/ HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin without exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 2.54 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 3x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted.

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