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Walsin, WLFM201609x, 2.0x1.6x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201609x, 2.0x1.6x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with.

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