Labels Milestones
BackFBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA.
- Connector, 43160-2102, With thermal vias in pads.
- 202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VSON, 8.
- -0.0896502 0.0431732 -0.995037 vertex 9.68164 2.48334 0.0479704.
- -3.464629e+000 -2.815020e+000 2.491820e+001 facet normal.
- THT HC-51/8mm http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal.