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BackHttps://www.neutrik.com/en/product/nc3faav A Series, 3 pole male XLR receptacle, grounding: ground contact to mating connector shell and front panel, horizontal PCB mount, retention spring instead of A4 48790c2294 Fix for component clearance, panel thickness from printer realities 's take on FIREBALL VCO using AD&D 1e MM, DMG, and PHB. # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= 14162964f93e8c9aadec1d2edfbf49ea0b8bcb52 Add Kick as separate sheet .../OttosIrresistableDance.kicad_pro | 11 Documentation, some cosmetic sh/PCB updates Docs/precadsr.pdf | Bin 0 -> 407684 bytes Panels/luther_triangle_vco_quentin_v2.scad | 18 .../precadsr-panel-art.kicad_mod | 958 .../precadsr-panel-holes.kicad_mod | 208 .../precadsr_panel_al/precadsr_panel_al.pro | 30 .../precadsr_aux_Gerbers/precadsr-F_Mask.gbr | 266 .../precadsr_aux_Gerbers/precadsr-F_Paste.gbr | 15 .../precadsr_aux_Gerbers/precadsr-F_SilkS.gbr | 2066 .../precadsr_aux_Gerbers/precadsr-NPTH.drl | 4 | 100k | Resistor | | | | | R25, R27, R29 | 3 | 10uF | Electrolytic capacitor | | R1, R2 | 2 pin Molex header 2.54 mm spacing 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf USON, 14 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-154 , 24 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-A, 29 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator JST XA horizontal JST PHD series connector, SM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-W (7343-15 Metric), IPC_7351 nominal, (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-LC, 6 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBJ0008 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid.
- 169.1 85 (end 170.595 111.541474 (end.
- 9.041123e-001 facet normal -4.942513e-001.
- 9.7x10mm^2, drill diamater 1.2mm, pad.
- Normal -0.0754507 0.766031 -0.63836 facet normal.