3
1
Back

Module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern PL-230, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 6 // manual reset (sw16 // 8 Sockets: // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13 // gate out // round shaft hole cylinder(r=shaft_radius,h=shaft_height, $fn=shaft_smoothness); if(shaft_is_flatted == true module set_screw_hole() { if(set_screw == true module set_screw_hole() { if(set_screw == true module set_screw_hole() { if(set_screw == true module set_screw_hole() { if(set_screw == true } } //noop.

New Pull Request