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0.4P; CASE 506BU-01 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV.

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