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Module Bluetooth https://www.yuden.co.jp/wireless_module/document/datareport2/en/TY_BLE_EYSGJNZ_DataReport_V1_9_20180530E.pdf Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XA series connector, LY20-40P-DLT1, 20 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 10 Pin (https://www.ti.com/lit/ds/symlink/tmp461.pdf#page=35 (RUN0010A)), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 10.6, Wuerth electronics 97730406330 (https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53048-0310, 3 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770972-x, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-126-02-xxx-DV, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0003 example for new part number: AE-6410-15A example for new mpn: 39-29-4069, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=34), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 43915-xx14, 7 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-0310, 3 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 12, Wuerth electronics 9774050951 (https://katalog.we-online.de/em/datasheet/9774050951.pdf), generated with kicad-footprint-generator JST ZE series connector, 502443-0970 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-22S-0.5SH, 22 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002142A.pdf#page=40), generated with kicad-footprint-generator Connector Phoenix Contact SPT 2.5/2-V-5.0-EX 1732496 Connector Phoenix Contact, SPT 5/7-V-7.5-ZB Terminal Block, 1719396 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719396), generated with kicad-footprint-generator ipc_noLead_generator.py TQFP, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EC), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.5 mm² wire, reinforced insulation, conductor diameter.

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