3
1
Back

24.13 mm (950 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 2.54mm TO-220-4, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge package, diameter 9.8mm, pin pitch 27.94mm 5W length 14.0mm width 5.0mm Capacitor C, Rect series, Radial.

New Pull Request