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BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip THT 2x37 2.00mm double row surface-mounted straight pin header, 2x38, 1.00mm pitch, single row Surface mounted socket strip THT 1x38 2.54mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x07 1.00mm double row Through hole angled pin header THT 2x03 2.54mm double row Through hole pin header SMD 2x24 2.00mm double row surface-mounted straight pin header, 1x24, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x19.

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