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Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4.

• Http://cdn-reichelt.de/documents/datenblatt/B400/DS_X22.pdf, 2.5x2.0mm^2 package SMD.
• Magnetics, through hole, DF13-09P-1.25DS, 9 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English.
• 496e3e3344 Correcting changed filename in .prl Correcting.

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