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HLE-127-02-xxx-DV-BE, 27 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 6.15.

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