synth_tools

Back

9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD DIP Switch SPST Slide 7.62mm 300mil SMD SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, horizontal, https://www.cliffuk.co.uk/products/testleads/sockets/S16NPC.pdf cliff 4mm socket jack banana C5080 SERIES 90° Wafer, (https://datasheet.lcsc.com/lcsc/1912261836_HR-Joint-Tech-Elec-C5080WR-04P_C477015.pdf connector side-entry ATA PATA IDE 5.25 inch floppy drive power Connector XT60 Horizontal PCB Male, https://www.tme.eu/en/Document/5e47640ba39fa492dbd4c0f4c8ae7b93/MR30PW%20SPEC.pdf Connector XT30 Horizontal PCB Male, https://www.tme.eu/en/Document/4acc913878197f8c2e30d4b8cdc47230/XT30UPB%20SPEC.pdf AMASS female XT60, through hole, DF13-14P-1.25DSA, 14 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64.

New Pull Request

Labels Milestones