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Number: 09-65-2108, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0730, 7 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator connector wire 1sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 6 times 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.5.

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