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X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header SMD 1x11 1.00mm single row Surface mounted socket strip THT 1x07 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x16, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header, 2x30, 2.54mm pitch, single row Through hole angled socket strip SMD 2x14 2.54mm double row Through hole angled socket strip, 1x22, 1.00mm pitch, 2.0mm.

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